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For the Inventor, By the Inventor

Bietigheim-Bissingen, Germany

Heiner Fees

This inventor holds 78 USPTO granted patents and 30 published patent applications and 18 EPO patents, primarily in Additive Manufacturing (CPC class B23K). Top assignees: Seurat Technologies, Inc., Tiveni Mergeco, Inc., Audi Ag. Active years: 1994-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heiner Fees. Retrieved from https://idiyas.com/inventor/heiner-fees

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 78 

% Patents Active = 94.9

 

Average Co-Inventor Count = 5.0

ph-index = 5

Forward Citations = 141(Granted Patents)

Forward Citations (Not Self Cited) = 110(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal34 out of 67 
 
Seurat Technologies, Inc.
 patents
silverMedal18 out of 18 
 
Tiveni Mergeco, Inc.
 patents
bronzeMedal9 out of 3,585 
 
Audi Ag
 patents
4. 6 out of 6 
 
Inevit LLC
 patents
5. 5 out of 6 
 
American Battery Solutions, Inc.
 patents
6. 2 out of 30,209 
 
Robert Bosch
 patents
7. 1 out of 108 
 
Brose Fahrzeugteile Se & Co. Kommanditgesellschaft, Bamberg
 patents
8. 1 out of 352 
 
Grammer Ag
 patents
9. 1 out of 80 
 
Mapal Fabrik Fur Prazisionswerkzeuge Dr. Kress Kg
 patents
10. 1 out of 1 
 
Tiveni Mergedco, Inc.
 patent
11. 1 out of 3,762 
 
Volkswagen Ag
 patents
where one patent can have more than one assignee

Years Active: 1994-2026

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Areas of Expertise:
Additive Manufacturing
Chamber Systems
Laser-Based Assembly
Material Recycling
Part Manipulation
Multi-Layer Contact Plate
Electron Beam Patterning
Powder Bed Fusion
Battery Module
Dynamic Optical Assembly
Welding Methods
Cooling Components
78 patents (USPTO):Explore Patents
1. 12703145 - Variable print chamber walls for powder bed fusion additive manufacturing (2026-08-11),
2. 12502831 - Chamber systems for additive manufacturing (2025-12-23),
3. 12472689 - Enclosed additive manufacturing system (2025-11-18),
4. 12454099 - Part manipulation using printed manipulation points (2025-10-28),
5. 12246488 - Dynamic optical assembly for laser-based additive manufacturing (2025-03-11),
6. 12186985 - Additive manufacturing system and method (2025-01-07),
7. 12162219 - Chamber systems for additive manufacturing (2024-12-10),
8. 12115720 - Electron beam patterning system in additive manufacturing (2024-10-15),
9. 12070902 - Variable print chamber walls for powder bed fusion additive manufacturing (2024-08-27),
10. 12042992 - Long and high resolution structures formed by additive manufacturing techniques (2024-07-23),
11. 11996530 - Multi-layer contact plate configured to establish electrical bonds to battery cells in a battery module (2024-05-28),
12. 11964429 - Light recycling for additive manufacturing optimization (2024-04-23),
13. 11911964 - Recycling powdered material for additive manufacturing (2024-02-27),
14. 11901573 - Non-welding joinder of exterior plates of a battery module (2024-02-13),
15. 11901531 - Methods of welding a bonding connector of a contact plate to a battery cell terminal (2024-02-13),

Title: Inventor Heiner Fees: Revolutionizing Technology in Bietigheim-Bissingen

Introduction: Heiner Fees, a visionary inventor based in Bietigheim-Bissingen, Germany, is renowned for his groundbreaking contributions to the field of technology.

Latest Patents: Heiner Fees holds several patents in the areas of renewable energy, sustainable transportation, and advanced robotics, showcasing his commitment to innovation and sustainability.

Career Highlights: With a career spanning over two decades, Heiner Fees has worked with leading tech companies to develop cutting-edge solutions that have reshaped industries and improved the quality of life for many.

Collaborations: Throughout his career, Heiner Fees has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of creativity and excellence in all his projects.

Conclusion: Heiner Fees continues to inspire the next generation of inventors with his passion for pushing the boundaries of technology and creating a more sustainable future for all.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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