The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Jul. 15, 2024
Applicant:
Seurat Technologies, Inc., Wilmington, MA (US);
Inventors:
James A. Demuth, Woburn, MA (US);
Erik Toomre, Los Altos, CA (US);
Francis L Leard, Sudbury, MA (US);
Kourosh Kamshad, Hudson, NH (US);
Heiner Fees, Bietigheim-Bissingen, DE;
Eugene M. Berdichevsky, Oakland, CA (US);
Assignee:
Seurat Technologies, Inc., Wilmington, MA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); B29C 64/153 (2017.01); B29C 64/182 (2017.01); B29C 64/20 (2017.01); B29C 64/264 (2017.01); B33Y 99/00 (2015.01); B22F 3/24 (2006.01); B22F 10/28 (2021.01); B23K 15/00 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/082 (2014.01); B23K 26/342 (2014.01); B23K 101/00 (2006.01); B23K 101/02 (2006.01); B23K 101/24 (2006.01); B23K 103/00 (2006.01); B25J 11/00 (2006.01); B33Y 30/00 (2015.01); G02B 19/00 (2006.01); G02B 27/00 (2006.01); G02B 27/10 (2006.01); G02B 27/14 (2006.01); G02B 27/28 (2006.01); G05B 17/02 (2006.01);
U.S. Cl.
CPC ...
B29C 64/20 (2017.08); B29C 64/153 (2017.08); B29C 64/182 (2017.08); B29C 64/264 (2017.08); B33Y 99/00 (2014.12); B22F 2003/247 (2013.01); B22F 2003/248 (2013.01); B22F 10/28 (2021.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B23K 15/0006 (2013.01); B23K 15/0013 (2013.01); B23K 15/002 (2013.01); B23K 15/0086 (2013.01); B23K 26/0006 (2013.01); B23K 26/03 (2013.01); B23K 26/082 (2015.10); B23K 26/083 (2013.01); B23K 26/342 (2015.10); B23K 2101/001 (2018.08); B23K 2101/02 (2018.08); B23K 2101/24 (2018.08); B23K 2103/00 (2018.08); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08); B25J 11/00 (2013.01); B33Y 30/00 (2014.12); G02B 19/0047 (2013.01); G02B 27/0068 (2013.01); G02B 27/108 (2013.01); G02B 27/141 (2013.01); G02B 27/283 (2013.01); G02B 27/286 (2013.01); G05B 17/02 (2013.01); G05B 2219/49023 (2013.01); Y02P 10/25 (2015.11);
Abstract
Additive manufacturing can involve dispensing a powdered material to form a layer of a powder bed on a support surface of a build platform. A portion of the layer of the powder bed may be selectively melted or fused to form one or more temporary walls out of the fused portion of the layer of the powder bed to contain another portion of the layer of the powder bed on the build platform