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Hamburg, Germany

Heiko Backer

This inventor holds 2 USPTO granted patents. Top assignees: Nxp B.v., U.S. Philips Corporation. Active years: 1999-2016.

USPTO Granted Patents = 2

% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)

Company Filing History:

1 out of 14,087

U.S. Philips Corporation

Years Active: 1999-2016

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2 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9349645 - Apparatus, device and method for wafer dicing (2016-05-24),

2. 5878941 - Method of soldering components on a carrier foil (1999-03-09),

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