The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1999
Filed:
Jul. 25, 1996
Applicant:
Inventors:
Heiko Backer, Hamburg, DE;
Reinhard Wendt, Hamburg, DE;
Assignee:
U.S. Philips Corporation, New York, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
22818021 ; 2282341 ;
Abstract
The invention relates to a method of soldering components on a carrier foil whereby hot gas is conducted onto the lower side of the carrier foil. Special soldering methods are necessary especially in SMD technology, whereby components can be soldered in large numbers on a carrier foil in a non-destructive manner both for the component itself and for the carrier foil. According to the invention, the hot gas is aimed at a soldering spot through a nozzle, heating this spot until solder heated by the hot gas flow melts on the surface of the carrier foil.