Location History:
- Hamburg, DE (2012)
- Weilburg, DE (2010 - 2017)
Company Filing History:
3 out of 300 
3 out of 7 Years Active: 2010-2017
Title: Heiko Aus Dem Spring: Innovator in Semiconductor Processing
Introduction
Heiko Aus Dem Spring is a notable inventor based in Weilburg, Germany. He has made significant contributions to the field of semiconductor processing, holding three patents that showcase his innovative approaches to material machining.
Latest Patents
His latest patents include a carrier and method for coating a carrier, as well as a method for the simultaneous double-side material-removing machining of semiconductor wafers. The carriers he developed are designed to receive one or more semiconductor wafers for machining in lapping, grinding, or polishing machines. These carriers consist of a core made from a high-stiffness material, which is either completely or partially coated with a thermoset polyurethane elastomer. This elastomer has a Shore A hardness ranging from 20 to 90. The innovative design allows for simultaneous double-side material-removing machining of multiple semiconductor wafers, enhancing efficiency in the manufacturing process.
Career Highlights
Heiko has worked with prominent companies in the semiconductor industry, including Siltronic AG and Peter Wolters GmbH. His experience in these organizations has contributed to his expertise in developing advanced machining techniques for semiconductor wafers.
Collaborations
Heiko has collaborated with notable professionals in his field, including Georg Pietsch and Michael Kerstan. Their combined efforts have furthered advancements in semiconductor processing technologies.
Conclusion
Heiko Aus Dem Spring is a distinguished inventor whose work in semiconductor processing has led to innovative solutions that improve manufacturing efficiency. His patents reflect a deep understanding of material properties and machining techniques, making him a valuable contributor to the industry.