Wachau, Germany

Heike Langnickel


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2006

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1 patent (USPTO):

Title: Heike Langnickel: Innovator in Wafer Technology

Introduction

Heike Langnickel is a prominent inventor based in Wachau, Germany. She has made significant contributions to the field of wafer technology, particularly in the production of DRAMs. Her innovative work has led to the development of a unique mark configuration that enhances the lithographic exposure process.

Latest Patents

Heike Langnickel holds 1 patent for her invention titled "Mark configuration, wafer with at least one mark configuration, and a method of producing at least one mark configuration." This patent describes a mark configuration designed for the alignment and determination of relative positions of at least two planes in relation to one another in a substrate. The invention includes a mark structure and at least one layer of definable thickness underneath the mark structure, which adjusts the physical position of the mark structure relative to a reference plane. This configuration allows for mark structures that exhibit good contrast, regardless of design or process conditions.

Career Highlights

Heike Langnickel has established herself as a key figure in the semiconductor industry. She works at Infineon Technologies AG, where her expertise in wafer technology is highly valued. Her contributions have played a crucial role in advancing the efficiency and effectiveness of lithographic processes.

Collaborations

Heike has collaborated with notable colleagues, including Hans-Georg Fröhlich and Johannes Kowalewski. These partnerships have fostered innovation and have been instrumental in the development of new technologies in the field.

Conclusion

Heike Langnickel's work exemplifies the spirit of innovation in the semiconductor industry. Her contributions to wafer technology and her patent on mark configurations highlight her role as a leading inventor. Her ongoing efforts continue to shape the future of lithographic processes in semiconductor manufacturing.

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