Infineon Technologies Ag

Heike Langnickel

Johannes Kowalewski

Hans-Georg Fröhlich

Frank Hübinger

Gerd Krause

Antje Lässig

Udo Götschkes

Reiner Trinowitz

A mark configuration for the alignment and/or determination of a relative position of at least two planes in relation to one another in a substrate and/or in layers on a substrate during lithographic exposure, in particular, in the case of a wafer during the production of DRAMs, includes a mark structure, and at least one layer of a definable thickness underneath the mark structure for adjusting the physical position of the mark structure relative to a reference plane in or on the substrate. Also provided is a wafer having such a configuration and a process for providing such a configuration. The invention allows a mark configuration to have mark structures exhibiting good contrast regardless of the design or the process conditions.

Mark configuration, wafer with at least one mark configuration, and a method of producing at least one mark configuration

Growing community of inventors

Wachau, Germany

Heike Langnickel