Heigo Tanaka

Title: Heigo Tanaka: Innovator in Double Side Polishing Technology

Introduction

Heigo Tanaka is a notable inventor based in Karatsu, Japan. He has made significant contributions to the field of polishing technology, particularly with his innovative methods for double side polishing. With a total of 2 patents, Tanaka's work has advanced the efficiency and quality of polishing processes.

Latest Patents

Tanaka's latest patents include a double side polishing method and apparatus. This invention provides a technique for rotating multiple carriers between upper and lower rotary surface plates to simultaneously polish both surfaces of various works. The work is merged with the carrier outside the polishing apparatus main body. The invention allows for the automatic supply of works onto the lower rotary surface plate while remaining merged with the carrier. After the double side polishing is completed, a liquid, such as water, is injected from the upper rotary surface plate to hold the works for polishing. The design enables the automatic ejection of works from the lower rotary surface plate, enhancing the overall efficiency of the polishing process.

Career Highlights

Throughout his career, Heigo Tanaka has worked with prominent companies such as Sumitomo Mitsubishi Silicon Corporation and Kashiwara Machine Manufacturing Co., Ltd. His experience in these organizations has contributed to his expertise in polishing technologies and innovations.

Collaborations

Tanaka has collaborated with notable coworkers, including Akira Horiguchi and Ken Isobe. Their collective efforts have furthered advancements in the polishing industry.

Conclusion

Heigo Tanaka's contributions to double side polishing technology exemplify his innovative spirit and dedication to improving manufacturing processes. His patents reflect a commitment to enhancing efficiency and quality in the industry.