Sumitomo Mitsubishi Silicon Corporation

Kashiwara Machine Mfg. Co., Ltd.

Heigo Tanaka

Akira Horiguchi

Ken Isobe

Hiroshi Matsumoto

Kiyohide Murata

Tomio Fukushima

Yoshiaki Uzu

Tsunco Takeda

Tsuneo Takeda

To provide a technique for rotating a plurality of carriersbetween an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works. The workis merged with the carrieroutside a polishing apparatus main body. The workis supplied onto a lower rotary surface plateof the polishing apparatus main bodywhile remaining merged with the carrier. The present invention enables the workon the lower rotary surface plateto be perfectly automatically supplied. After double side polishing has been completed and when an upper rotary surface plate, a liquid such as a water is injected from the upper rotary surface plate to hold the plurality of worksto have both surfaces thereof polished, on the lower rotary surface plate. The present invention enables the worksto be automatically ejected from the lower rotary surface plate. A brush housing sectionand a dresser housing sectionare provided near the polishing apparatus main body. Brushes and dressers are used to frequently efficiently process polishing clothes installed on opposite surfaces of the upper and lower rotary surface plates to efficiently and economically achieve high-quality double side polishing.

Double side polishing method and apparatus

A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works () integrally with the carriers () on the outside of a polishing device main body (), feeding the works () onto a rotating surface plate () on the underside of the polishing device main body () with the works formed integrally with the carriers (), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works () on the lower side rotating surface plate () after the double sides are polished, enabling the works () to be discharged automatically from the lower side rotating surface plate (), providing a brush storage part () and a dresser storage part () near the polishing device main body (), and frequently treating a polishing cloth installed on the opposed surfaces of the upper and lower rotating surface plates with a brush and a dresser.

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Karatsu, Japan

Heigo Tanaka