This inventor holds 1 USPTO granted patent. Top assignee: Magnachip Semiconductor, Inc.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Heejin Park: Innovator in Semiconductor Technology
Introduction
Heejin Park is a prominent inventor based in Cheongju-si, South Korea. She has made significant contributions to the field of semiconductor technology, particularly in the development of innovative packaging solutions.
Latest Patents
Heejin Park holds a patent for a "Wafer level chip scale package of power semiconductor and manufacturing method thereof." This invention includes a semiconductor substrate with a specific thickness, an input-output pad, a front metal layer, a back metal layer, and a metal bump, all designed to enhance the performance and efficiency of power semiconductors. She has 1 patent to her name.
Career Highlights
Heejin Park is currently employed at Magnachip Semiconductor, Inc., where she continues to push the boundaries of semiconductor technology. Her work has been instrumental in advancing the capabilities of power semiconductor packaging.
Collaborations
Heejin collaborates with talented individuals such as Myungho Park and Beomsu Kim, contributing to a dynamic team focused on innovation in the semiconductor industry.
Conclusion
Heejin Park's contributions to semiconductor technology exemplify her dedication to innovation and excellence. Her work continues to impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile