Company Filing History:
9 out of 19,775 
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2 out of 778 Years Active: 2003-2008
Title: Innovative Minds: The Inventions of HeBen Liu
Introduction
HeBen Liu, an accomplished inventor based in Shenzhen, China, has made significant contributions to the field of technology with a total of 12 patents to his name. His work primarily focuses on enhancing thermal management and mounting solutions, especially within computer hardware.
Latest Patents
Among his latest innovations is a mounting device for fans, designed to securely install multiple fans onto a server chassis. This device features a tray with mounting sections and U-shaped brackets that effectively sandwich fans between side plates, ensuring stability and optimal function. The design also incorporates fasteners that lock the fans in place, enhancing the reliability of thermal management systems.
Another notable invention is a heat dissipation device that aims to improve the efficiency of heat management in graphics cards. It consists of two heat sinks, heat pipes that transfer heat between the sinks, and fans that create airflow through enclosed channels. This innovative approach effectively dissipates heat, ensuring that video graphics adapters operate smoothly under heavy loads.
Career Highlights
HeBen Liu has worked with some of the leading companies in the tech industry, including Hon Hai Precision Industry Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these companies has allowed him to contribute to various cutting-edge projects, significantly influencing hardware design and functionality.
Collaborations
Throughout his career, Liu has collaborated with talented engineers and inventors, including coworkers Hsieh Kun Lee and Wanlin Xia. These partnerships have played a crucial role in the ideation and development of his innovative products, demonstrating the power of teamwork in the field of invention.
Conclusion
HeBen Liu stands out as a forward-thinking inventor, continuously pushing the boundaries of technology through his patents. His innovations in mounting and heat dissipation solutions not only improve the performance of electronic devices but also contribute to the efficiency and longevity of hardware systems. As he continues to innovate, the impact of his contributions will undoubtedly be felt across the technology landscape for years to come.