This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2020-2022.
Company Filing History:
Years Active: 2020-2022
Title: Hea-Sung Kim: Innovator in Printed Circuit Board Technology
Introduction
Hea-Sung Kim is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of printed circuit board technology. With a total of 3 patents to his name, Kim continues to push the boundaries of innovation in electronics.
Latest Patents
Kim's latest patents include groundbreaking designs for printed circuit boards. One of his notable inventions is a printed circuit board that features a first insulating layer, an embedded pattern on one surface, a pad, and a post that contacts the insulating layer. Another significant patent involves a printed circuit board and package structure that incorporates an insulating material with a bump pad, multiple insulating layers, and a bump disposed on the bump pad.
Career Highlights
Hea-Sung Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in developing advanced electronic components. His work has been instrumental in enhancing the performance and reliability of printed circuit boards.
Collaborations
Throughout his career, Kim has collaborated with talented colleagues, including Yoong Oh and Gyu-Mook Kim. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Hea-Sung Kim's contributions to printed circuit board technology exemplify his dedication to innovation and excellence. His patents reflect a commitment to advancing the field and improving electronic devices.