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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10991647 B1

PDFFull Text
Date of Patent:
Apr. 27, 2021

Filed:

Oct. 21, 2019

Printed circuit board and package structure having the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Yoong Oh, Suwon-si, KR;

Sang-Hoon Kim, Suwon-si, KR;

Hea-Sung Kim, Suwon-si, KR;

Gyu-Mook Kim, Suwon-si, KR;

Young-Kuk Ko, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Tong-Ho Kim

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 25/00 (2013.01);
Abstract

A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.

Find Patent Forward Citations

Oh, Yoong. (2021). Printed circuit board and package structure having the same (U.S. Patent No. 10991647). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10991647

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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