Haruyuki Goto

Title: Haruyuki Goto: Innovator in Semiconductor Manufacturing

Introduction

Haruyuki Goto is a notable inventor based in Yokosuka, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding 2 patents that showcase his innovative methods and techniques.

Latest Patents

His latest patents include a "Method for dicing semiconductor substrates using a laser scribing." This method involves scribing a silicon substrate along dicing lines with a laser, followed by etching away the resolidified silicon that did not vaporize during the process. The result is a separation of the silicon substrate into multiple mesa semiconductor pellets, which are then chemically etched to smooth the cut surfaces. Another patent is for a "Method of manufacturing a semiconductor element." This improved method prevents cracks or damage during the manufacturing process and allows for the deposition of solder layers without irregularities in thickness. The process begins with forming a first metal layer on the semiconductor wafer, followed by selectively depositing a second metal layer through electroplating. The portions of the wafer between active elements are then chemically etched off, resulting in individual semiconductor elements coated with both metal layers.

Career Highlights

Throughout his career, Haruyuki Goto has worked with prominent companies such as Kabushiki Kaisha Toshiba and Tokyo Shibaura Denki Kabushiki Kaisha. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

He has collaborated with notable coworkers, including Katsuhiko Kubota and Kisaku Nakamura, further enhancing his contributions to the field.

Conclusion

Haruyuki Goto's innovative approaches to semiconductor manufacturing have made a lasting impact on the industry. His patents reflect a commitment to improving manufacturing processes and enhancing the quality of semiconductor elements.