Warabi, Japan

Haruya Yamada

This inventor holds 2 USPTO granted patents and 1 published patent application and 3 EPO patents. Top assignee: Lintec Corporation. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Haruya Yamada. Retrieved from https://idiyas.com/inventor/haruya-yamada

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.9

ph-index = 1


Company Filing History:


Years Active: 2020

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2 patents (USPTO):Explore Patents

Title: Haruya Yamada - Innovator in Electrically Peelable Adhesive Technology

Introduction

Haruya Yamada is an inventor based in Warabi-shi, Japan. He has made significant contributions to the field of adhesive technology, particularly with his innovative approach to electrically peelable adhesive compositions. His work focuses on creating adhesives that can effectively change their properties when subjected to electrical voltage.

Latest Patent Applications

Haruya Yamada's notable patent application is titled "ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABLE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE ADHESIVE SHEET." This application describes an electrically peelable pressure-sensitive adhesive composition that consists of an emulsion type acrylic pressure-sensitive adhesive. The composition includes an acrylic polymer obtained through emulsion polymerization in the presence of a surfactant, using a monomer mixture that comprises an alkyl(meth)acrylate and a (poly)alkylene polyol with a number average molecular weight of 2000 or less. The formulation is designed to maintain high adhesiveness before voltage application while allowing for effective reduction in adhesiveness upon voltage application for a short duration.

Conclusion

Haruya Yamada's innovative work in electrically peelable adhesive technology showcases his commitment to advancing adhesive applications. His contributions have the potential to impact various industries that rely on adhesive solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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