Haruo Sorimachi

Title: Haruo Sorimachi: Innovator in Multi-Chip Module Technology

Introduction

Haruo Sorimachi is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of multi-chip modules. With a total of 5 patents to his name, Sorimachi's work has had a substantial impact on improving heat dissipation in electronic devices.

Latest Patents

Sorimachi's latest patents include innovative methods for creating multi-chip modules that enhance thermal management. One of his notable inventions is a method of making a multi-chip module having an improved heat dissipation. This design features a substrate with an interconnection pattern, multiple semiconductor chips, thermally conductive blocks, and a resin package body that encapsulates these components. A heat sink is mounted on the upper surface to ensure effective heat dissipation.

Another significant patent is for a multi-chip module that includes semiconductor chips on a top surface of multi-layered interconnection circuits. This design incorporates thermal contacts that utilize laminated interconnection layers and thermal conductors, ensuring efficient thermal management within the module.

Career Highlights

Haruo Sorimachi is currently employed at Fujitsu Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of multi-chip modules, which are essential for modern electronic devices.

Collaborations

Throughout his career, Sorimachi has collaborated with notable colleagues, including Kiyoshi Satoh and Takumi Suzuki. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Haruo Sorimachi's contributions to the field of semiconductor technology, particularly in multi-chip module design, have established him as a leading inventor. His innovative patents reflect a commitment to improving electronic device performance through effective thermal management.