Fujitsu Corporation

Haruo Sorimachi

Takumi Suzuki

Kiyoshi Satoh

Takashi Ozawa

Kazuaki Satoh

Fumiaki Yamada

Kiyotaka Seyama

Minoru Terashima

Toshio Matsuzaki

Makoto Sumiyoshi

Takeshi Sugii

Toshiaki Naka

Takeo Kanno

Kiyoshi Sato

A multi-chip module includes a substrate, an interconnection pattern provided on the substrate, a plurality of semiconductor chips provided commonly upon the substrate in electrical connection with the interconnection pattern, a plurality of thermally conductive blocks each provided on corresponding one of the plurality of semiconductor chips in an intimate contact therewith, a resin package body that encapsulates the plurality of semiconductor chips and the plurality of thermally conductive blocks together with the substrate, such that the resin package body has an upper major surface substantially flush with the upper major surfaces of the plurality of thermally conductive blocks, and a heat sink mounted upon the upper major surface of the resin package body such that the heat sink establishes an intimate contact with respective upper major surfaces of the thermally conducting blocks.

Method of making a multi-chip module having an improved heat dissipation

A multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered interconnection circuits comprising alternatively laminated interconnection layers with insulating layers, and thermal contacts, each of the thermal contacts comprising successively laminated interconnection layers on a bottom and on side-walls of a vertical hole penetrating a plurality of the insulating layers, and a thermal conductor filling the vertical hole on the successively laminated interconnection layers, and (b) a plurality of the semiconductor chips attached to the thermal conductor. In a preferred embodiment, a V-shaped vertical hole is formed in the insulating layers of polyimide for a thermal contact, copper films are successively laminated thereon, unpatterned copper and gold films are deposited thereon, and the entire surface of the metal film including the hole is coated by a silver-powder containing epoxy film, to which semiconductor chips are adhered.

Multi-chip module having thermal contacts

A thermal recording head comprising an insulating substrate which has thereon a heat generating resistor pattern made of a thin-film resistor, an electrode pattern having a common power supply electrode pattern portion and a common grounded electrode pattern portion, for supplying the power to the resistor pattern, and a controlling electrode pattern portion, and switching elements for controlling the supply of the power to the resistor pattern. The electrode pattern is made of a thick-film copper paste by a printing process. The operation of the switching elements is controlled by the controlling electrode pattern portion. Also disclosed is a process for manufacturing a wiring substrate for a thermal recording head.

Thermal recording head and process for manufacturing wiring substrate

Cracks in an Ta.sub.2 O.sub.5 anti-abrasion layer of a thermal printing head resulting from the crystallization of the Ta.sub.2 O.sub.5 in the layer, are suppressed by the addition of SiO.sub.2 to the layer. The anti-abrasion layer is provided as a uniform mixture of Ta.sub.2 O.sub.5 and SiO.sub.2 throughout the layer by sputtering a target composed of a mixture containing tantalum and silicon ingredients onto an antioxidation layer. The thermal printing head is also subjected to annealing to stabilize the resistivity of the heating elements.

Thermal printing head with an anti-abrasion layer and method of

A crossover construction of a thermal-head is which the thermal-head comprises: a substrate of insulating material; a plurality of heat elements disposed side by side in one row on said substrate; a plurality of lower thin film conductor patterns each of which connects to each of said heat elements and extends in direction X; an insulating layer disposed over said lower conductors; a plurality of upper conductor patterns disposed in parallel in another direction Y on said insulating layer so as to form a crossover on said substrate, said upper and lower conductors being selectively connected together through openings of said insulating layer, wherein said insulating layer and said upper conductors comprise printed and cured paste of insulating material and conductive material, respectively, each paste being of the low temperature curing type which can be cured at a temperature low enough not to affect the resistance of said thin film lower conductors, and a metallic layer of low resistance is coated on each of said upper conductors.

Crossover construction of thermal-head and method of manufacturing same

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Kawasaki, Japan

Haruo Sorimachi