This inventor holds 1 USPTO granted patent. Top assignee: Fujifilm Corporation. Active years: 2008.
Company Filing History:
Years Active: 2008
Title: Haru Okawa: Innovator in Solid-State Image Pickup Technology
Introduction
Haru Okawa is a notable inventor based in Miyagi, Japan. He has made significant contributions to the field of solid-state image pickup technology. His innovative work has led to the development of a patented substrate that enhances the performance of solid-state image pickup elements.
Latest Patents
Haru Okawa holds a patent for a substrate designed for forming a solid-state image pickup element. The patent, titled "Substrate for forming a solid-state image pickup element, solid-state image pickup element using the same, and method of producing the same," describes a substrate that includes an n-type silicon substrate and an n-type epitaxial growth layer. This substrate is specifically configured to form a solid-state image pickup element, which consists of a photoelectric converting section and a charge transferring section. The n-type silicon substrate has a specific resistance of 10/1,000 Ωcm or less, making it suitable for high-performance applications. He has 1 patent to his name.
Career Highlights
Haru Okawa is associated with Fujifilm Corporation, a leading company in imaging and information technology. His work at Fujifilm has been instrumental in advancing the capabilities of solid-state imaging technologies. His innovative approach has contributed to the company's reputation for excellence in the field.
Collaborations
Haru Okawa has collaborated with notable colleagues, including Eiichi Okamoto and Fumitoshi Toyokawa. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Haru Okawa's contributions to solid-state image pickup technology exemplify the spirit of innovation. His patented work continues to influence advancements in imaging technology, showcasing the importance of research and development in this field.
