Eindhoven, Netherlands

Harshitha Thippur Shivamurthy


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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2 patents (USPTO):

Title: Harshitha Thippur Shivamurthy: Innovator in Integrated Circuit Packaging

Introduction

Harshitha Thippur Shivamurthy is a talented inventor based in Eindhoven, Netherlands. She has made significant contributions to the field of integrated circuit packaging, showcasing her innovative spirit and technical expertise.

Latest Patents

Harshitha holds a patent for a unique package that includes an integrated circuit (IC) die. This die is designed to generate signaling for transmission to a waveguide and/or receive signaling from a waveguide via a launcher. The die is coupled to an interconnect layer that extends out from its footprint. The launcher is formed in a separate launcher-substrate and is coupled to the die to facilitate signaling through a connection in the interconnect layer. The design includes a launcher element mounted in a first plane within the launcher-substrate, along with a waveguide-cavity that features a ground plane arranged opposite and spaced from the first plane. The waveguide-cavity is further defined by at least one side wall extending from the ground plane towards the first plane. The die and launcher are at least partially surrounded by mold material of the package. Harshitha has 1 patent to her name.

Career Highlights

Harshitha is currently employed at NXP B.V., where she continues to push the boundaries of technology in her field. Her work has been instrumental in advancing integrated circuit packaging solutions, making her a valuable asset to her company.

Collaborations

Throughout her career, Harshitha has collaborated with notable colleagues, including Giorgio Carluccio and Michael B. Vincent. These partnerships have allowed her to enhance her projects and contribute to innovative solutions in the industry.

Conclusion

Harshitha Thippur Shivamurthy is a remarkable inventor whose work in integrated circuit packaging exemplifies innovation and technical prowess. Her contributions to the field are noteworthy, and she continues to inspire others in the realm of technology.

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