Nxp B.v.

Harshitha Thippur Shivamurthy

Antonius Johannes Matheus De Graauw

Giorgio Carluccio

Michael B Vincent

Leo Van Gemert

Maristella Spella

Adrianus Buijsman

Pieter Lok

Maarten Lont

Rocío Gabriela Molina Moreno

Cristine Aguila Badiao

Rabia Syeda

A system comprising: a waveguide assembly comprising a plurality of waveguides, the plurality of waveguides comprising at least a first waveguide and a second waveguide, and an integrated circuit package, IC package, comprising a plurality of launchers to one or more of transmit signalling to and receive signalling from a respective one of the plurality of waveguides, wherein the waveguide assembly comprises a surface configured to be coupled to the IC package and each of the plurality of waveguides comprises an opening in the surface configured to be aligned with its respective launcher, and wherein each of the openings has a major dimension and a minor dimension, wherein the major dimension is larger than the minor dimension, and wherein the major dimension of at least the opening of the first waveguide is oriented perpendicular to the major dimension of the opening of the second waveguide.

System

A package includes an integrated circuit, IC, die having circuitry configured to generate signalling for transmission to a waveguide and/or receive signalling from a waveguide via a launcher. The die is coupled to an interconnect layer extending out from a footprint of the die. The launcher is formed in a launcher-substrate, separate from the die. The launcher is coupled to the die to pass the signalling therebetween by a connection in the interconnect layer. The launcher includes a launcher element mounted in a first plane within the launcher-substrate and a waveguide-cavity including a ground plane arranged opposed to and spaced from the first plane. The waveguide-cavity is further defined by at least one side wall extending from the ground plane towards the first plane. The die and launcher are at least partially surrounded by mould material of the package.

Package

Growing community of inventors

Eindhoven, Netherlands

Harshitha Thippur Shivamurthy