Seattle, WA, United States of America

Harry J Paarsch

This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Harry J Paarsch. Retrieved from https://idiyas.com/inventor/harry-j-paarsch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Innovations by Harry J Paarsch

Introduction

Harry J Paarsch is an accomplished inventor based in Seattle, WA. He has made significant contributions to the field of data measurement and analysis. His innovative approach focuses on reducing bias in test data through the adjustment of outlier data.

Latest Patents

Harry J Paarsch holds a patent titled "Measuring test effects using adjusted outlier data." This patent addresses the challenges posed by outlier data in test and control datasets. The invention involves selecting a cutoff point along the distribution of data to maintain data below this point for effect determination. The method also includes processing the data above the cutoff by identifying predictor data from the lower range and using it to assess the effects of the outlier data.

Career Highlights

Harry is currently employed at Amazon Technologies, Inc., where he applies his expertise in data analysis and measurement. His work contributes to the development of advanced technologies that enhance data accuracy and reliability.

Collaborations

Harry collaborates with notable colleagues, including Zhuo Zhang and Patrick Ludvig Bajari. Their combined efforts foster innovation and drive progress in their respective fields.

Conclusion

Harry J Paarsch's work exemplifies the importance of innovation in data measurement. His patent reflects a commitment to improving data analysis techniques, which can have far-reaching implications in various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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