Harry Fuerhaupter is a notable inventor based in Lombard, Illinois. He has made significant contributions to the field of microelectronics, holding a total of six patents. His work primarily focuses on the development of advanced microelectronic packages.

Latest Patents

One of Fuerhaupter's latest patents is for a microelectronic package that includes a polymer encapsulated die. This innovative package features an integrated circuit die attached to a substrate through solder bump interconnections. The design includes a gap between the active face of the die and the substrate, allowing for effective thermal management. The encapsulation process involves a mold that defines a cavity around the die, where a polymeric precursor is dispensed and cured to form a protective encapsulant.

Career Highlights

Fuerhaupter has spent a significant portion of his career at Motorola Corporation, where he has been instrumental in advancing microelectronic technologies. His expertise in the field has led to numerous innovations that enhance the performance and reliability of electronic devices.

Collaborations

Throughout his career, Fuerhaupter has collaborated with several talented individuals, including Cynthia M. Melton and Francis J. Carney, Jr. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Harry Fuerhaupter's contributions to microelectronics through his innovative patents have had a lasting impact on the industry. His work continues to influence the design and functionality of electronic devices today.

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