St. Petersburg, FL, United States of America

Harpuneet Singh

USPTO Granted Patents = 4 

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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4 patents (USPTO):Explore Patents

Title: Harpuneet Singh: Innovator in 3D Printing Technology

Introduction

Harpuneet Singh is a notable inventor based in St. Petersburg, FL (US). He has made significant contributions to the field of 3D printing, particularly in the development of support blocks for printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs). With a total of 4 patents to his name, Singh continues to push the boundaries of innovation in his field.

Latest Patents

Harpuneet Singh's latest patents include the "Enhanced 3D Printed Support Block" and the "Screen Printer Including 3D Printed Support Block for Supporting Article During Printing." Both patents focus on support blocks produced through a 3D printing process. The support blocks feature a bottom surface with a vacuum connection, a top surface with at least one vacuum hole, at least one recessed surface offset from the top surface, and at least one vacuum channel extending from the vacuum connection to the vacuum hole. These innovations enhance the efficiency and effectiveness of PCB and PCBA manufacturing.

Career Highlights

Singh is currently employed at Jabil Inc., a leading company in the manufacturing and supply chain solutions sector. His work at Jabil has allowed him to apply his innovative ideas in a practical setting, contributing to the advancement of technology in the industry.

Collaborations

Some of Harpuneet Singh's coworkers include Darin Burgess and Randy Crockett. Their collaboration fosters a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Harpuneet Singh is a prominent figure in the realm of 3D printing technology, with a focus on enhancing support structures for electronic components. His contributions through patents and his work at Jabil Inc. highlight his commitment to innovation and excellence in engineering.

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