logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11785754 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Jun. 21, 2022

Enhanced 3d printed support block

Applicant:

Jabil Inc., St. Petersburg, FL (US);

Inventors:

Darin Burgess, St. Petersburg, FL (US);

Randy Crockett, St. Petersburg, FL (US);

Timothy DeRosett, St. Petersburg, FL (US);

Charles Santhakumar, St. Petersburg, FL (US);

Scott Klimczak, St. Petersburg, FL (US);

Anwar A. Mohammed, St. Petersburg, FL (US);

Luke Rodgers, St. Petersburg, FL (US);

Harpuneet Singh, St. Petersburg, FL (US);

Daniel Torres, St. Petersburg, FL (US);

Felipe Torres, St. Petersburg, FL (US);

Assignee:

JABIL INC., St. Petersburg, FL (US);

Attorneys:

Shumaker, Loop & Kendrick, LLP

James D. Miller

Primary Examiner:

Paul D Kim

Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 13/04 (2006.01); H05K 13/00 (2006.01); B25B 11/00 (2006.01); B29C 64/364 (2017.01); B41F 15/08 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B41F 15/18 (2006.01); B41F 15/34 (2006.01); B41F 15/46 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0069 (2013.01); B25B 11/002 (2013.01); B25B 11/005 (2013.01); B29C 64/364 (2017.08); B41F 15/08 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B41F 15/18 (2013.01); B41F 15/34 (2013.01); B41F 15/46 (2013.01); H05K 2203/0165 (2013.01);
Abstract

Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Find Patent Forward Citations

Loading…