Harold W Conru

Title: Harold W. Conru: Innovator in Semiconductor Technology

Introduction

Harold W. Conru is a notable inventor based in Essex Junction, VT (US), recognized for his contributions to semiconductor technology. He holds 2 patents that showcase his innovative approach to enhancing semiconductor leadframe packages.

Latest Patents

One of his latest patents involves a personalized area leadframe coining or half etching for reduced mechanical shear-stress at the peripheral edge of a semiconductor chip. This lead on chip (LOC) semiconductor leadframe package features notched lead-fingers designed to eliminate mechanical shear-stress. The opposite rows of substantially flat cantilevered lead-fingers are attached by double-sided adhesive tape in thermal contact with the active face of a chip. The lead-fingers are routed in personalized paths over the chip's face to cover a large surface area, aiding in heat dissipation. All wirebond connections between the lead-fingers and the chip are made at a centerline connection strip running down the center of the chip. Each cantilevered lead-finger has a notched portion positioned directly over the vulnerable peripheral chip edge to reduce thermal and mechanical shear-stress. Additionally, the notch provides an increasing path length to prevent corrosive ingress over the chip face.

Career Highlights

Throughout his career, Harold has worked with prominent companies such as IBM and Siemens Aktiengesellschaft. His experience in these organizations has contributed significantly to his expertise in semiconductor technology.

Collaborations

Some of his notable coworkers include Francis E. Froebel and Albert J. Gregoritsch, Jr. Their collaboration has likely influenced the innovative projects they undertook together.

Conclusion

Harold W. Conru's work in semiconductor technology has led to significant advancements in the field. His patents reflect a deep understanding of the challenges faced in semiconductor design and manufacturing.