Harold S Fenger

Title: Harold S. Fenger: Innovator in Circuit Board Technology

Introduction

Harold S. Fenger is a notable inventor based in Thousand Oaks, California. He has made significant contributions to the field of circuit board technology, holding two patents that showcase his innovative approach to electronic design.

Latest Patents

Fenger's latest patents include a design for a rigid/flexible circuit board. This invention features an anisotropic film positioned outwardly from a first flexible dielectric layer, with a second flexible dielectric layer also disposed outwardly from the anisotropic film. The design allows for conductive traces to be coupled to pads, while the anisotropic film creates a via region that electrically isolates the conductive traces of the two layers. Another patent focuses on a circuit board assembly and method for attaching a chip to a circuit board using a fillet bond that does not cover RF traces. This method involves directly attaching a flip chip transmit/receive (T/R) module to an antenna circuit board, enhancing the efficiency of antenna array assembly.

Career Highlights

Fenger is currently employed at Raytheon Company, where he continues to develop innovative solutions in circuit board technology. His work has contributed to advancements in electronic systems, particularly in the defense and aerospace sectors.

Collaborations

Throughout his career, Fenger has collaborated with talented professionals, including Mark S. Hauhe and Kevin C. Rolston. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Harold S. Fenger's contributions to circuit board technology exemplify his commitment to innovation. His patents reflect a deep understanding of electronic design and a drive to improve the functionality of circuit boards. His work at Raytheon Company continues to influence the industry positively.