Raytheon Company

Harold S Fenger

Clifton Quan

Mark S Hauhe

Tse E Wong

Kevin C Rolston

Richard W Nichols

Ike Chang

According to one embodiment, a circuit board comprises an anisotropic film disposed outwardly from a first flexible dielectric layer, and a second flexible dielectric layer disposed outwardly from the anisotropic film. The first and second flexible dielectric layers each have at least one conductive trace conductively coupled to a pad. The anisotropic film forms a via region that conductively couples the pad of the first flexible dielectric layer to the pad of the second flexible dielectric layer, and electrically isolates the conductive trace of the first flexible dielectric layer from the conductive trace of the second flexible dielectric layer.

Rigid/flexible circuit board

An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module.

Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces

Growing community of inventors

Thousand Oaks, CA, United States of America

Harold S Fenger