Harold M Cook

Title: Harold M Cook: Innovator in Integrated Circuit Packaging

Introduction

Harold M Cook is a notable inventor based in Boynton Beach, FL (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 5 patents. His work has been instrumental in advancing technology in electronic components.

Latest Patents

One of Harold's latest patents is the "Reversible heat sink packaging assembly for an integrated circuit." This innovative packaging assembly includes a chip carrier with an opening formed therein and a heat sink attached to one side of a die. The die fits into the opening of the carrier, allowing for versatile orientation, either device side up or down. Another significant patent is the "Thermal dissipation package for an electrical surface mount component." This patent describes an electronic component, such as a power transistor, formed of a molded plastic package that provides heat dissipation capability from both the top and bottom surfaces.

Career Highlights

Harold M Cook has had a distinguished career at Motorola Corporation, where he has applied his expertise in electronic packaging. His innovative designs have contributed to the efficiency and performance of various electronic devices.

Collaborations

Throughout his career, Harold has collaborated with talented individuals such as Jose L Diaz and Edmund B Boucher. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Harold M Cook's contributions to integrated circuit packaging have made a lasting impact on the electronics industry. His innovative patents and collaborative efforts continue to influence the field, showcasing his dedication to advancing technology.