The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Dec. 10, 2002
Applicant:
Inventors:
Jose Diaz, Pembroke Pines, FL (US);
Harold M. Cook, Boynton Beach, FL (US);
Edmund B. Boucher, Fort Lauderdale, FL (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract
A reversible heat sink packaging assembly ( ) for integrated circuits is provided. The packaging assembly ( ) includes a chip carrier ( ) having an opening ( ) formed therein and a heat sink ( ). The heat sink ( ) is attached to one side of a die ( ). The die ( ) fits into the opening ( ) of the carrier ( ) with the heat sink ( ) abutting one side ( ) of the carrier and the die being wire bonded ( ) to the other side ( ) of the carrier. The packaging assembly ( ) can be oriented either device side up or down.