Motorola Corporation

Harold M Cook

Jose L Diaz

Edmund B Boucher

Rudy Yorio

Jose I Suarez

William J Martin

James V Lauder

Joseph A Budano, Ii

Kenneth Charles Barnett

Andrzei T Guzik

A reversible heat sink packaging assembly ( ) for integrated circuits is provided. The packaging assembly ( ) includes a chip carrier ( ) having an opening ( ) formed therein and a heat sink ( ). The heat sink ( ) is attached to one side of a die ( ). The die ( ) fits into the opening ( ) of the carrier ( ) with the heat sink ( ) abutting one side ( ) of the carrier and the die being wire bonded ( ) to the other side ( ) of the carrier. The packaging assembly ( ) can be oriented either device side up or down.

Reversible heat sink packaging assembly for an integrated circuit

An electronic component ( ), such as a power transistor, is formed of a molded plastic package having top ( ), bottom ( ) and side ( ) surfaces and electrical contacts. A lead frame ( ) attaches to one of the contacts and wraps about the component ( ) so as to provide heat dissipation capability from the bottom and top surfaces of the molded plastic package.

Thermal dissipation package for an electrical surface mount component

A VCO (Voltage Controlled Oscillator) (10) operates in a phase-locked loop at a desired frequency. One input to the VCO is a variable control signal (24) that holds the VCO at the desired frequency. Another input is a bias input (40) that changes the operating point of a transistor (34) in the VCO and also tends to change the VCO's frequency. The value of the variable control signal (24) is sensed while the bias input (40) is changed until a desired, minimum value of the control signal is sensed. The value of the bias input at that point is held constant while operating the VCO at the desired frequency and with minimal side band noise.

Automatically tuning a voltage controlled oscillator for minimum side

An RF contact (2) provides multiple RF paths (51-53) with minimal RF path lengths between a first (8) and second (36) interconnecting surfaces. A stationary member (6) is soldered on the first surface (8). A main spring member (22) is resiliently (26) connected to the stationary member (6) on a springing end (27) to provide contact travel (38) which ensures wiping action with the second surface (36). A secondary spring member (28) having at least two wiping portions (42 and 46) is resiliently (29) connected to the displacement member on its other end (38) to engage the stationary member (6) and the main spring member (22) along the at least two wiping portions (42 and 46) when the main spring member (22) is resiliently biased against the secondary spring member (28) and the stationary member (6).

RF interconnect

A coaxial connector includes a housing carrying an insulator. The insulator carries a center contact with a spring biasing the cneter contact. A volute spring engages the housing and provides the ground or shield contact. The housing is formed of two halves with the volute spring and alignment pins holding the housing halves together. A coaxial cable has its shield clamped between the housing halves for providing the ground connection to the volute spring. The coaxial cable center conductor is connected to the center contact within the housing.

Growing community of inventors

Boynton Beach, FL, United States of America

Harold M Cook