Harlan Lawler

Title: Harlan Lawler - Innovator in Die Bonding Process

Introduction

Harlan Lawler is a notable inventor based in Milpitas, California. He is recognized for his contributions to the field of semiconductor packaging, particularly through his innovative die bonding process. His work has significantly impacted the reliability and efficiency of semiconductor devices.

Latest Patents

Harlan Lawler holds a patent for a die bonding process that involves several critical steps. This process includes providing an adhesion layer to the back surface of the silicon die, which enhances adhesion to both the die and a subsequently applied barrier layer. The barrier layer is designed to be impervious to silicon, preventing migration during the bonding process. The bonding layer, preferably made of gold, is activated using a binder composition, typically a gold-tin alloy solder. This innovative approach results in highly reliable bonds, with enhanced electrical and thermal contact characteristics.

Career Highlights

Harlan Lawler has made significant strides in his career, working at Fairchild Semiconductor Corporation. His expertise in semiconductor technology has led to advancements in die bonding techniques, which are crucial for the manufacturing of reliable electronic components. His contributions have been instrumental in improving the performance of semiconductor devices.

Collaborations

Harlan has collaborated with various professionals in the field, including his coworker William S. Phy. Their combined efforts have fostered innovation and development in semiconductor packaging technologies.

Conclusion

Harlan Lawler's work in the die bonding process exemplifies the importance of innovation in the semiconductor industry. His contributions have paved the way for more reliable and efficient electronic devices, showcasing the impact of dedicated inventors in technology advancement.