Hillsboro, OR, United States of America

Harinath Reddy

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Harinath Reddy. Retrieved from https://idiyas.com/inventor/harinath-reddy-3i8ytoll

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Harinath Reddy: Innovator in Electroless Plating Technology

Introduction

Harinath Reddy is a notable inventor based in Hillsboro, OR (US). He has made significant contributions to the field of electroless plating technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency and uniformity of plating processes.

Latest Patents

Harinath Reddy holds a patent for "Methods and apparatus for electroless plating dispense." This invention features a single-substrate electroless plating apparatus that includes a workpiece chuck, which is rotatable and inclinable. The chuck's inclination can be controlled to improve the uniformity of surface wetting and the residence time of the plating solution. The design allows for active control of the inclination angle during the dispense of the plating solution, optimizing the plating process.

Career Highlights

Harinath Reddy is currently employed at Intel Corporation, where he applies his expertise in plating technology. His work has been instrumental in advancing the capabilities of electroless plating, making processes more efficient and effective.

Collaborations

Harinath has collaborated with several talented individuals, including Harsono S Simka and Christopher D Thomas. These collaborations have contributed to the successful development and implementation of innovative plating solutions.

Conclusion

Harinath Reddy's contributions to electroless plating technology exemplify his commitment to innovation and excellence in engineering. His work continues to influence the industry and improve manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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