This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sky Chip Interconnection Technology Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Haoyang Xiao and His Packaging Technology Patent.
Introduction
Haoyang Xiao is an inventor based in Shenzhen, China. His work includes a patent for a packaging method and package member, and he is associated with Sky Chip Interconnection Technology Co., Ltd.
Latest Patents
Xiao is named on 1 patent: “Packaging Method and Package Member.” The invention describes a process for forming a package around a chip. It uses a carrier, first and second pads, and two sealing materials to create first and second sealing members. A chip is mounted on a chip pad before the second sealing material is applied, forming a layered package structure.
Career Highlights
Xiao’s patent focuses on chip packaging, including the arrangement of pads and sealing materials around a mounted chip. The disclosed method outlines successive processing and sealing steps intended to form the package member.
Collaborations
Xiao’s listed coworkers include Yuhong Li and Chenshan Gao. His company affiliation is Sky Chip Interconnection Technology Co., Ltd.
Conclusion
Haoyang Xiao’s patent documents a chip-packaging approach that combines layered pads and sealing members, reflecting his work in semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile