The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Aug. 30, 2023
Sky Chip Interconnection Technology Co., Ltd., Shenzhen, CN;
Yuhong Li, Shenzhen, CN;
Haoyang Xiao, Shenzhen, CN;
Chenshan Gao, Shenzhen, CN;
Guanqiang Song, Shenzhen, CN;
Jing Jiang, Shenzhen, CN;
SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD., Shenzhen, CN;
Abstract
A packaging method includes: obtaining a carrier and processing a first pad on a side surface of the carrier; processing a second pad on a side surface of the first pad away from the carrier; obtaining a first sealing material, pressing the first sealing material with the second pad, the first pad, and a side surface of the carrier on which the first pad is arranged to form a first sealing member; processing a chip pad on a side surface of each first pad away from the second pad; mounting a chip on at least one chip pad; obtaining a second sealing material, pressing the second sealing material with the chip, a side surface of the chip pad away from the second pad, and a side surface of the first sealing member near the first pad, to form a second sealing member.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile