This inventor holds 1 USPTO granted patent. Top assignee: Sky Chip Interconnection Technology Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chenshan Gao and His Packaging Innovation.
Introduction
Chenshan Gao is an inventor based in Shenzhen, China. His patent work concerns packaging methods and package structures.
Latest Patents
Gao is associated with 1 patent: “Packaging Method and Package Member.” The method describes forming a package through successive sealing steps. It begins with a carrier and a first pad, then adds a second pad and presses a first sealing material against the pads and carrier to form a first sealing member. Chip pads are then processed, and a chip is mounted on at least one of them. Finally, a second sealing material is pressed against the chip, chip pad, and first sealing member to form a second sealing member.
Career Highlights
Gao’s listed patent reflects work on layered packaging and sealing processes for chip assemblies. He is associated with Sky Chip Interconnection Technology Co., Ltd.
Collaborations
Gao’s listed coworkers include Yuhong Li and Haoyang Xiao.
Conclusion
Chenshan Gao’s patent focuses on a staged packaging process that combines carrier, pad, chip, and sealing components into a package member.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile