This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Sky Chip Interconnection Technology Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Guanqiang Song and Semiconductor Packaging Innovation.
Introduction
Guanqiang Song is an inventor based in Shenzhen, China, associated with Sky Chip Interconnection Technology Co., Ltd. His patent work addresses semiconductor packaging, with a method for forming sealed structures around a carrier and mounted chip.
Latest Patents
Song is associated with 1 patent: “Packaging Method and Package Member.” The invention describes processing a first pad on a carrier, forming a first sealing member around the pad and carrier, and adding a chip pad to the structure. A chip is mounted on at least one chip pad, after which a second sealing material is pressed against the chip, chip pad, and first sealing member to form a second sealing member. This approach outlines a layered packaging process that integrates the chip and sealing materials with the carrier.
Career Highlights
Song’s listed patent reflects work in semiconductor packaging and package-member design. The disclosed method focuses on arranging pads and sealing materials in successive stages to create a packaged chip structure.
Collaborations
Song’s listed coworkers include Yuhong Li and Haoyang Xiao. His company affiliation is Sky Chip Interconnection Technology Co., Ltd.
Conclusion
Guanqiang Song’s patent describes a staged sealing method for integrating a chip with a carrier, pads, and protective packaging materials.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile