This inventor holds 1 USPTO granted patent. Top assignee: Micrel, Incorporated. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: Haowei Wu: Innovator in Chip-Scale Packaging Technology
Introduction
Haowei Wu is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative techniques for chip-scale packages. His work has implications for the efficiency and effectiveness of electronic devices.
Latest Patents
Haowei Wu holds a patent for a "Chip-scale package conversion technique for dies." This method describes a process for converting an existing die, originally designed for a non-chip-scale package, into a chip-scale package die. The technique involves shifting the die's layout relative to a grid of candidate positions for bonding pads until an optimal alignment is achieved. The bonding pad positions are then selected based on this optimal alignment, allowing for the fabrication of the die using original and new masks. This innovation enhances the bonding of chip-scale packages to printed circuit boards (PCBs) using advanced technology.
Career Highlights
Haowei Wu is currently employed at Micrel, Incorporated, where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.
Collaborations
Throughout his career, Haowei has collaborated with notable colleagues, including Robert W Rumsey and Richard Dolan. These partnerships have fostered an environment of innovation and creativity, contributing to advancements in their field.
Conclusion
Haowei Wu's contributions to chip-scale packaging technology exemplify the impact of innovative thinking in the semiconductor industry. His patent and ongoing work at Micrel, Incorporated highlight his role as a key player in advancing electronic device efficiency.