This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hao-Jan Shih: Innovator in Semiconductor Packaging
Introduction
Hao-Jan Shih is an inventor based in Hsinchu, Taiwan. He is known for his contributions to the field of semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Hao-Jan Shih has submitted several notable patent applications. One of his applications is titled "PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME." This application describes a package structure that includes a first substrate and a second substrate. The first substrate features first bumps with a greater lateral dimension and second bumps with a smaller lateral dimension. The first bumps are distributed in a specific region of the first substrate, while the second bumps are located in another region. The application emphasizes the differences in bump height and lateral dimensions.
Another significant application is "BONDING SCHEME FOR SEMICONDUCTOR PACKAGING." This method involves forming a device region along a first substrate and creating an interconnect structure over this region. The process includes forming a metal pillar with multiple layers and a solder region, followed by an etching process to refine the structure.
Conclusion
Hao-Jan Shih is an emerging inventor in the semiconductor packaging industry, showcasing innovative concepts through his latest patent applications. His work reflects a commitment to advancing technology in this critical field.