Company Filing History:
Years Active: 2004
Title: Innovations by Hao-Chih Tien: A Pioneer in Semiconductor Manufacturing
Introduction: Hao-Chih Tien, based in Hsin-Chu, Taiwan, is recognized for his contributions to the semiconductor industry, particularly through his innovative patent in bumping processes. With a robust understanding of semiconductor technologies, Tien has made strides in enhancing manufacturing techniques.
Latest Patents: Tien holds a distinctive patent titled "Fluxless Bumping Process Using Ions." This patent details a sophisticated method that involves providing a semiconductor device with a bond pad and an under bump metallurgy overlaying the bond pad. The process includes forming a solder structure that incorporates an outer layer of tin oxide. Furthermore, Tien's method involves producing plasma from gases such as CF, SF, and H, which is then exposed to the solder structure. Through a precise heating and cooling process, a solder bump is established on the semiconductor device, showcasing a significant advancement in semiconductor production methodologies.
Career Highlights: Currently, Hao-Chih Tien is associated with Taiwan Semiconductor Manufacturing Company Limited, one of the leading firms in semiconductor manufacturing worldwide. His role emphasizes innovation and efficiency in production processes, which is critical in a fast-evolving technological landscape.
Collaborations: Tien collaborates with notable peers such as Hsin-Hui Lee and Chia-Fu Lin, working together to push the boundaries of what is possible in semiconductor technologies. These collaborations demonstrate the importance of teamwork in the advancement of industry practices and the continuous search for innovative solutions.
Conclusion: As an inventor, Hao-Chih Tien exemplifies the spirit of innovation within the semiconductor sector. His patent for a fluxless bumping process utilizing ions not only reflects his expertise but also contributes significantly to the efficiency and effectiveness of semiconductor manufacturing. Through his work, Tien continues to impact the industry positively, driving advancements that pave the way for future innovations.