Hans-Fr Schmidt

Title: Innovations of Hans-Fr Schmidt

Introduction

Hans-Fr Schmidt is a notable inventor based in Eurasburg, Germany. He has made significant contributions to the field of electrical and electronic encapsulation, holding a total of five patents. His work focuses on enhancing the protection and functionality of electronic components through innovative methods.

Latest Patents

One of his latest patents is a method for encapsulating electrical or electronic components. This invention involves a housing formed of at least two joined parts, with terminal legs conducted toward the outside. To improve the sealing effect and protect against internal corrosion, a thermoplastic plastic encapsulation is applied by injection molding, particularly at the joints and exit regions of the terminal legs. Another significant patent is a method for applying a solder resist layer to a printed circuit board. This method involves the application of a solder resist and a positively-acting photoresist, which are selectively exposed and developed. This technique is particularly beneficial for three-dimensional printed circuit boards, where traditional mask techniques are not applicable.

Career Highlights

Throughout his career, Hans-Fr Schmidt has worked with prominent companies such as Siemens Aktiengesellschaft and Michael Huber GmbH. His experience in these organizations has contributed to his expertise in the field of electronic component encapsulation.

Collaborations

He has collaborated with notable coworkers, including Siegfried Rauchmaul and Juergen Bednarz. Their combined efforts have further advanced the innovations in their respective fields.

Conclusion

Hans-Fr Schmidt's contributions to the field of electronics through his patents and collaborations highlight his role as a significant inventor. His innovative methods continue to influence the industry and enhance the protection of electronic components.