The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 1989

Filed:

Dec. 03, 1987
Applicant:
Inventors:

Juergen Frankel, Baldham, DE;

Antoon Mattelin, Oostkamp, BE;

Pol Pecceu, Brugge, BE;

Ferdinand Quella, Neubiberg, DE;

Hans-Fr Schmidt, Eurasburg, DE;

Luc Boone, Oostkamp, BE;

Sybille Von Tomkewitsch, Poecking, DE;

Marc De Vogelaere, Zedelgem, BE;

Assignees:

Siemens Aktiengesellschaft, Berlin and Munich, DE;

Michael Huber GmbH, Heimstetten, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ; C25D / ;
U.S. Cl.
CPC ...
427 531 ; 106-121 ; 204 384 ; 427 98 ; 4271265 ; 4274431 ;
Abstract

A method and coating material for applying electrically conductive printed patterns to insulating substrates is provided. The coating material includes a non-metallic, grainy carrier substance having metal of the oxidation degree 0 applied thereto. An energy radiation source, particularly of a deflectable laser beam, is used to secure anchoring of the carrier substance to the substrate in the region of the desired printed pattern. As a consequence of a three-dimensional arrangement of the metal, a three-dimensional nuclei distribution is produced that leads to a reliable and fast metallization of the printed pattern on the basis of chemical metal deposition. The method of the invention is especially suited for laser pattern transfer for the manufacture of printed circuit boards.


Find Patent Forward Citations

Loading…