Hanns-Heinz Peltz

Title: Innovations by Hanns-Heinz Peltz: A Focus on Electronic Encapsulation

Introduction

Hanns-Heinz Peltz, a renowned inventor based in Munich, Germany, has made significant contributions to the field of electrical and electronic component encapsulation. With a portfolio of five patents, he has focused on innovative methods that enhance the durability and performance of electronic assemblies.

Latest Patents

Two of his latest patents address methods and encapsulation techniques for protecting electronic components housed in multi-part constructions. His innovations include the application of a thermoplastic plastic through injection molding, particularly at the joints of the housing and exit regions of terminal legs. This method not only improves sealing effectiveness against corrosion but also ensures a hermetically tight encapsulation for sensitive devices such as surface-wave filters.

Career Highlights

Peltz has had an illustrious career, working for Siemens Aktiengesellschaft, among other notable companies. His expertise in the integration of encapsulation methods into electronic components has positioned him as a leading figure in the industry.

Collaborations

Throughout his career, Hanns-Heinz Peltz has collaborated with accomplished colleagues, including Siegfried Rauchmaul and Hans-Fr Schmidt. These partnerships have enabled him to refine his innovations and drive advancements in encapsulation technologies.

Conclusion

Hanns-Heinz Peltz continues to be a key player in the field of electronic encapsulation, with a strong focus on protecting vital components from corrosion and external elements. Through his patents and collaborative efforts, he has significantly influenced the landscape of electronic component manufacturing.