Siemens Aktiengesellschaft

Other

Wacker-Chemie Gmbh

Hanns-Heinz Peltz

Hans-Fr Schmidt

Horst Scheffler

Juergen Bednarz

Siegfried Rauchmaul

Karl-Heinz Horsmann

Ralf Criens

Dietrich Wolfer

Gerhard Mitterhummer

Fritz Conzelmann

Heinrich Mayer

A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.

Method and an encapsulation for encapsulating electrical or electronic

Method for encapsulating electronic components or assemblies using a

An electrically conductive adhesive having elasticity over a wide temperature range of approximately -60.degree. C. to about 180.degree. C. for securing sensitive electronic components to a foundation is provided.

Electrically conductive adhesive for a broad range of temperatures

Device (1) for facilitating the circulation of fluid coolant having, in compact form, a circulating pump (7), a settling cascade (17) and a negative-pressure pump (20) for suctioning a workpiece (54) onto a worktable (21). The transfer pump (7) and a negative-pressure pump (20) are connected to operate with one another in the coolant cycle and to prevent loss of coolant.

Device for facilitating the circulation of fluid coolant

Method of producing a metallic carrier system mounting, making conductive contact with a semi-conductor member through relatively thin tongue-like inner feed lines made from a different metal than the metal of the carrier. The inner feed lines are made from a metal that can readily be connected with the electrodes of the semi-conductor, such as nickel. The thin feed lines extend from the outer support and connection legs and are made from a different metal that can readily be soldered, such as brass and have conductive contact with said legs. The inner feed lines and carrier are made by an etching process. The inner feed lines supporting the semi-conductor are resilient, and by their resiliency balance thermal expansion between the semi-conductor substrate and the coarse structure of the connection legs of the system carrier.

Method of producing metallic carrier system for a multi-electrode

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Munich, Germany

Hanns-Heinz Peltz