The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 1977

Filed:

Aug. 30, 1976
Applicant:
Inventors:

Gerhard Mitterhummer, Munich, DT;

Hanns-Heinz Peltz, Munich, DT;

Heinrich Mayer, Munich, DT;

Fritz Conzelmann, Koeigsbrunn, DT;

Assignee:

Siemens Aktiengesellschaft, Berlin & Munich, DT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J / ; C23F / ;
U.S. Cl.
CPC ...
29588 ; 29591 ; 29627 ; 156151 ; 156634 ; 156661 ; 204 15 ; 357 70 ;
Abstract

Method of producing a metallic carrier system mounting, making conductive contact with a semi-conductor member through relatively thin tongue-like inner feed lines made from a different metal than the metal of the carrier. The inner feed lines are made from a metal that can readily be connected with the electrodes of the semi-conductor, such as nickel. The thin feed lines extend from the outer support and connection legs and are made from a different metal that can readily be soldered, such as brass and have conductive contact with said legs. The inner feed lines and carrier are made by an etching process. The inner feed lines supporting the semi-conductor are resilient, and by their resiliency balance thermal expansion between the semi-conductor substrate and the coarse structure of the connection legs of the system carrier.


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