Company Filing History:
Years Active: 2025
Title: HanChung Huang: Innovator in Semiconductor Polishing Methods
Introduction
HanChung Huang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the methods used for polishing semiconductor substrates. His innovative approaches have the potential to enhance the efficiency and quality of semiconductor manufacturing processes.
Latest Patents
HanChung Huang holds a patent for "Methods for polishing semiconductor substrates." This patent discloses methods that may involve alternating a first and second polishing slurry during the polishing process. The first and second slurries each contain silica particles, with the silica particles of the first slurry containing more silica than those of the second slurry. By alternating between the first and second polishing slurries, this method may improve wafer flatness, which is crucial for the performance of semiconductor devices.
Career Highlights
HanChung Huang is associated with GlobalWafers Co., Ltd., a leading company in the semiconductor industry. His work at GlobalWafers has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in semiconductor manufacturing.
Collaborations
HanChung collaborates with talented individuals such as Sherry Chi and Patrick Lin. Their teamwork fosters an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor field.
Conclusion
HanChung Huang's contributions to semiconductor polishing methods exemplify the importance of innovation in technology. His work not only enhances manufacturing processes but also sets a foundation for future advancements in the semiconductor industry.