Han Wooi Lim

Title: The Innovations of Han Wooi Lim

Introduction

Han Wooi Lim is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of integrated circuit devices, holding a total of 4 patents. His work focuses on enhancing the efficiency and connectivity of programmable logic fabrics.

Latest Patents

One of his latest patents is titled "Fabric die to fabric die interconnect for modularized integrated circuit devices." This innovative design includes a direct fabric die-to-fabric die interconnect interface column located within a sector of programmable logic fabric. Each row of this interconnect interface column features at least one interconnect interface that is electrically coupled to a microbump. The microbump is designed to connect electrically to another microbump of a different interconnect interface from another fabric die through an interposer. The fabric die can incorporate multiple interconnect interface columns that extend deep into the sector, facilitating low latency connections between the fabric dies and minimizing routing congestion. In some instances, the fabric die may also have interconnect interfaces distributed throughout the logic blocks of the sector.

Career Highlights

Han Wooi Lim has worked with prominent companies in the technology sector, including Intel Corporation and Altera Corporation. His experience in these organizations has contributed to his expertise in developing advanced integrated circuit technologies.

Collaborations

Throughout his career, Han has collaborated with talented individuals such as Chee Hak Teh and Chee Seng Leong. These partnerships have likely fostered innovation and creativity in his projects.

Conclusion

Han Wooi Lim's contributions to the field of integrated circuit devices demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and its applications in modern electronics.