Han-Sung Ryu

Title: Innovations of Han-Sung Ryu in Semiconductor Technology

Introduction

Han-Sung Ryu is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on enhancing the performance and efficiency of semiconductor chips and packages.

Latest Patents

Among his latest patents, Han-Sung Ryu has developed a semiconductor chip that includes a bump structure and a semiconductor package incorporating the same. This semiconductor chip features a substrate with a low-k material layer and an electrode pad surrounded by a first protection layer. The design includes a buffer pad electrically connected to the electrode pad, with a second protection layer surrounding the buffer pad. The innovative structure ensures that the thickness of the buffer pad exceeds that of the electrode pad, optimizing performance. Additionally, he has patented a wafer level package that consists of a substrate and multiple semiconductor chips mounted on it, with molding members that have varying coefficients of thermal expansion.

Career Highlights

Han-Sung Ryu is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

He has collaborated with notable colleagues, including Byoung-rim Seo and Yong-Hoe Cho, contributing to various projects that enhance semiconductor technology.

Conclusion

Han-Sung Ryu's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a key figure in the industry. His work continues to influence the development of advanced electronic components.