This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Skhynix Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Han Suk Ko and Memory Packaging Innovation.
Introduction
Han Suk Ko is an inventor associated with Gyeonggi-do, South Korea. His listed patent concerns memory packaging and memory-module design.
Latest Patents
Ko is credited with 1 patent: “Memory package and memory module including the memory package.” The invention describes a package with a substrate supporting an integrated memory chip and buffer chip. The memory chip contains an embedded interface modulator, specifically a serializing modulator that includes a multi-level amplitude modulator.
Career Highlights
The supplied information associates Ko with SK hynix Inc. His patent focuses on integrating memory and buffering components while incorporating signal-modulation functionality into the memory chip.
Collaborations
Ko’s listed coworker is Uksong Kang. The provided information does not specify the nature of their collaboration.
Conclusion
Han Suk Ko’s recorded patent reflects work on integrated memory-package architecture and modulation, connecting his inventive activity with SK hynix Inc.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile