The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Feb. 13, 2023
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventors:
Assignee:
SK hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 80/00 (2026.01); G11C 5/06 (2006.01); H10W 20/20 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); G11C 5/06 (2013.01); H10W 20/20 (2026.01); H10W 72/879 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01); H10W 90/754 (2026.01);
Abstract
A single memory package includes: a substrate; and a memory chip and a buffer chip that are integrated over the substrate, wherein the memory chip includes an interface modulator embedded therein, and the interface modulator is a serializing modulator including a multi-level amplitude modulator.
Choi, Won. (2026). Memory package and memory module including the memory package (U.S. Patent No. 12652808). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12652808
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile