Han Na Jin

Title: Innovations by Han Na Jin in Semiconductor Packaging

Introduction

Han Na Jin is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

Han Na Jin's latest patents include a method of manufacturing a semiconductor package that features a connection structure with tapering connections via layers. This innovative semiconductor package comprises a connection structure with opposing first and second surfaces, which includes multiple insulating layers, redistribution layers, and connection vias. At least one semiconductor chip is placed on the first surface, with connection pads that are electrically linked to the redistribution layers. An encapsulant covers the first surface, encapsulating the semiconductor chip. The package also includes UBM layers with UBM pads on the second surface and UBM vias connecting to a redistribution layer. Notably, at least one connection via adjacent to the first surface has a tapered structure that narrows toward the second surface, while the other connection vias and UBM vias taper toward the first surface.

Career Highlights

Han Na Jin is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technology. His expertise in manufacturing processes and design has positioned him as a key player in the industry.

Collaborations

Throughout his career, Han Na Jin has collaborated with notable colleagues, including Tae Sung Jeong and Young Gwan Ko. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Han Na Jin's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.